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CHICO 2023

Workshop on Chiplet-based Heterogeneous Integration and CO-design

July 9, 2023
Moscone Center
San Francisco, CA

Contemporary microelectronic design is facing tremendous challenges in memory bandwidth, processing speed and power consumption. Although recent advances in monolithic design (e.g. near-memory and in-memory computing) help relieve some issues, the scaling trend is still lagging behind the ever increasing demand of AI, HPC and other applications.

In this context, technological innovations beyond a monolithic chip, such as 2.5D and 3D packaging at the macro and micro levels, are critical to enabling heterogeneous integration with various types of chiplets, and bringing significant performance and cost benefits for future systems. Such a paradigm shift further drives new innovations on chiplet IPs, heterogeneous architectures and system mapping.

This workshop is designed to be a forum that is highly interactive, timely and informative, on the related topics:

  • Roadmap and technology perspectives of heterogeneous integration
  • IP definition of chiplets
  • Signaling interface cross chiplets
  • Network topology for data movement
  • Design solutions for power delivery
  • Thermal management
  • High-level synthesis for the chiplet system
  • Architectural innovations
  • Ecocystems of IPs and EDA tools

Tentative Program

8:15am – 8:30amIntroduction and opening remarks
8:30am – 11:00amSession 1: Chiplet-based 2.5D/3D System

Madhavan Swaminathan (Pennsylvania State University): Heterogeneous Integration – A 10 Year & Beyond Roadmap: Design Space Exploration, Co-Design & Optimization for Future Chiplet Systems
Rangharajan Venkatesan (NVidia): Flexible Performance Scaling with Multi-Chip-Modules
Deepak Kulkarni (AMD): Heterogeneous Integration with Chiplets
Paul Fahey (SK Hynix): From 2.5D to 3D, Learnings from HBM SIP Technology
Farah Fahim (Fermi Lab): Co-designed Chiplets for 3D Integration: Advanced Scientific Instrumentation
11:00am – 11:30amPanel Discussion
11:30am – 1:30pmLunch
1:30pm – 4:30pmSession 2: Ecosystem for Chiplet-based Integration

Sung-kyu Lim (DARPA): Fine-Grained Physical Design Automation for Densely Digital 3D ICs
John Damoulakis (Cadence): Speeding-up 3DIC Technology – The E
Rob Aitken (Synopsys): Ecosystem for Chiplet-based Systems
Anthony Mastroianni (Siemens): Heterogeneous Design Methods
Arindam Mallik (IMEC): Addressing the Innovator’s Dilemma in an Increasingly Expensive World
Syrus Ziai (Eliyan): Developing Efficient Chiplets for High Performance Applications
4:30pm – 5:00pmPanel Discussion


Yu (Kevin) Cao, Arizona State University

Puneet Gupta, University of California, Los Angeles

Frank Liu, Oak Ridge National Lab